Cloud Expo Asia Singapore 2021
Event submitted on Wednesday, October 7th 2020, approved by Charles Villanueva ✓
363 Days Until The Event
October 20th, 2021
- October 21st, 2021
Singapore
» Marina Bay Sands
Event Website
This event has been tagged as follows:
Our Review
This is one of the best Cloud Conferences in Singapore in 2021. Indeed, we’d even recommended this conference for all those security professionals in the APAC region.
- Review written by Henry Dalziel on Wednesday, October 7th 2020.
- If you would like to edit or ammend facts in my review please either send us a message or connect with me via LinkedIn.
Event Summary
The following description was either submitted by the Conference Organizer on Wednesday, October 7th 2020, or created by us.
Cloud Expo Asia, Singapore, Asia’s largest and best-attended technology event, returns on 20-21 October 2021 for its 8th edition at Marina Bay Sands, Singapore.
Cloud Expo Asia is the leading event for connecting technologists and business leaders with experts, solutions, and services to help accelerate digital transformation plans.
In 2019, 21,897 (BPA audited) technology buyers and influencers attended to be a part of this leading technology event in Asia. 450 leading international technology exhibitors like Huawei, Citrix, Equinix, Telstra, Tencent Cloud, Adobe, Nokia, Digital Realty, Oracle, and Silver Peak signed up to share their best-of-breed technologies. 600 expert speakers discussed the latest industry trends and most relevant cloud-related topics.
This year, you can expect enhanced conference content, new special features, and more opportunities to network with some of the world’s leading technology companies. And it’s still free to attend.
Cloud Expo Asia is co-located with Cyber Security World, Big Data & AI World, Smart IoT Singapore, Data Centre World, eCommerce Expo Asia and Technology for Marketing Asia.
Register your interest in the 2021 edition of Cloud Expo Asia, Singapore to learn, touch, and explore the latest disruptive business technologies.
