Webinar Description
Key Takeaways
- Presents proprietary analysis of 116 recent US privacy settlements, examining trends in settlement amounts and lawsuit volumes
- Identifies which federal and state laws, including CIPA, are driving the most litigation
- Examines how third-party pixels and mobile apps contribute to wiretapping and privacy violation claims
- Designed for privacy officers, general counsels, compliance teams and risk managers in digital businesses
About the Webinar
This live webinar from Privado AI presents findings from the 2026 Website Privacy Litigation Report, offering a data-driven examination of how privacy settlement amounts and lawsuit volumes are changing across the United States. The research draws on analysis of 116 recent privacy settlements to identify patterns in litigation outcomes and the factors contributing to increased payouts.
Frankfurt Kurnit (FKKS) serves as the legal partner for the session, which includes a Q&A segment with privacy and legal practitioners.
Privacy Litigation Trends and Third-Party Technology Risks
The session focuses on wiretapping lawsuits and broader privacy violation claims, with particular attention to how third-party tracking pixels embedded on websites contribute to legal exposure. The research identifies which pixel technologies appear most frequently in settlement cases and how mobile applications factor into litigation risk.
Attendees will learn which industries face the highest settlement activity and how specific laws are shaping enforcement patterns. The California Invasion of Privacy Act (CIPA) features prominently among the statutes examined.
Who Should Attend
The webinar targets privacy, legal and compliance professionals responsible for managing digital risk. This includes Chief Privacy Officers, Data Protection Officers, General Counsels and IT security leaders. Executives and managers at e-commerce companies, SaaS providers and app-based businesses will find the industry risk benchmarking relevant to their compliance and legal defense planning.